The memory bottleneck has become a major concern in modern Systems-on-a-Chip (SoC) since the size of on-chip embedded memory continues to increase, already reaching up to 75% of the total SoC real estate in some applications like Artificial Intelligence (AI) and Machine Learning (ML). However, the industry standard Static Random Access Memory (SRAM) technology is very area-inefficient and has been facing major scaling difficulties in modern process technologies below 10nm. 

“RAAAM’s Gain-Cell Random Access Memory (GCRAM) technology is a unique on-chip memory solution that only requires 3 transistors to store a bit of data, as opposed to 6-8 transistors needed for the existing SRAM-based highest-density memory technology. The GCRAM solution reduces area by half and power consumption by a factor of five and can be manufactured cost efficiently using the standard CMOS process” said Robert Giterman, RAAAM Co-Founder and CEO. “Our GCRAM technology was successfully validated on silicon in various nodes including Bulk CMOS, FD-SOI, and FinFET processes of leading foundries. RAAAM currently aims to migrate its GCRAM memory technology to nodes smaller than 5nm and to fully qualify it for production according to the industry standards.”

RAAAM was founded by four PhDs from Bar-Ilan University and the Swiss Federal Institute of Technology Lausanne (EPFL) that are specializing in Very Large-Scale Integration (VLSI) design. The company is leveraging know-how that was gained over many years of research.

Michael Stucky, CIO at Serpentine Ventures commented: “RAAAM, led by an exceptional founding team, is introducing a new on-chip memory category, transforming the silicon industry with a novel approach to higher density and lower power chips.”

“RAAAM’s innovative memory technology promises to significantly alleviate the memory bottleneck by reducing off-chip memory accesses through increased on-chip storage at no additional cost”, commented Ram Ofir, who will join RAAAM’s board of directors, representing J-Ventures.

About RAAAM Memory Technologies

RAAAM has developed the most cost-effective on-chip memory technology in the semiconductor industry, providing 50% area reduction over high-density SRAM and reduced power consumption by a factor of five. RAAAM’s patented technology can be used by semiconductor companies as a drop-in replacement for SRAM in their SoCs and can be manufactured cost efficiently using the standard CMOS process allowing to significantly reduce the die size. Founded in 2021, the company is headquartered in Israel with R&D center in Switzerland.

Contact info@raaam-tech.com for more information.

RAAAMTM Contact:

Michelle Goldenfeld

P: +972 54-970-9135

E: Michelle.goldenfeld@raaam-tech.com

The post RAAAM Memory Technologies closes $4M Seed round to commercialize super cost effective on-chip memory solutions appeared first on RAAAM Technologies.

“RAAAM’s technology has been developed and is now being tested to demonstrate its performances and benefits” said Robert Giterman, RAAAM Co-Founder and CEO. “Now, we are in the process of commercializing it, including full technology qualification in advanced process nodes and Eran will lead that activity, leveraging his vast experience in developing cutting-edge VLSI solutions and leading hundreds of commercial chipstape outs during his career”.

“For many years I have not seen such a revolutionary technology like the one RAAAM is offering”, commented Eran Rotem. “I am looking forward to be part of this unique team that is going to make an enormous impact on the Semiconductors market”.

About RAAAM Memory Technologies Ltd.
RAAAM has developed the most cost-effective on-chip memory technology in the semiconductor industry, providing up-to 50% area reduction and up-to 10X power reduction over high-density SRAM. RAAAM’s patented technology can be used by semiconductor companies as a drop-in replacement for SRAM in their SoCs and can be manufactured using standard CMOS processes. This solution
enables larger on-chip memory capacity in a smaller silicon die size. Founded in 2021, the company is headquartered in Israel with a R&D center in Switzerland.

Contact info@raaam-tech.com for more information.

RAAAM^TM Contact:

Michelle Goldenfeld

P: +972 54-970-9135

E: Michelle.goldenfeld@raaam-tech.com

The post RAAAM™ Memory Technologies Expands Leadership Team with the Addition of Eran Rotem as VP R&D appeared first on RAAAM Technologies.

Founded in 2021, RAAAM^TM is focused on providing a cost-effective solution for the increased need of on-chip memory. Its patented technology enables customers to implement the same memory capacity in half the die size and reduce power consumption by up to 10X.

The appointment of Eli supports RAAAM^TM’s growing customer traction as the company enters its next phase of growth. Eli will lead the activities to sign customers and partners leveraging his strong business experience.

“Over the past three years, we have been focused on developing our solution and validating its advantages” said Robert Giterman, RAAAM^TM Co-Founder and CEO. “Now, we are ready for the next phase of commercializing our technology and to accelerate customer engagements, and Eli is joining us to help us in this next phase”.

“RAAAM^TM is uniquely positioned to address the ever-growing need for large on-chip SRAM memories”, commented Thomas Seiler, RAAAM^TM Chairman of the Board. “Its patented GCRAM technology, which allows up-to 50% reduction in die size for the same memory capacity, will allow companies to develop more cost-efficient solutions. Eli is the person to lead the customer’s activities and bring the revenues to RAAAM^TM”.

About RAAAM^TM Memory Technologies Ltd.

RAAAM^TM has developed the most cost-effective on-chip memory technology in the semiconductor industry, providing up-to 50% area reduction and up-to 10X power reduction over high-density SRAM. RAAAM^TM’s patented technology can be used by semiconductor companies as a drop-in replacement for SRAM in their SoCs and can be manufactured using the standard CMOS process. This solution enables larger on-chip memory capacity in a smaller silicon die size. Founded in 2021, the company is headquartered in Israel with a R&D center in Switzerland.

Contact info@raaam-tech.com for more information.

RAAAM^TM Contact:

Michelle Goldenfeld

P: +972 54-970-9135

E: Michelle.goldenfeld@raaam-tech.com

The post RAAAM™ Memory Technologies Expands Leadership Team With the Addition of Eli Leizerovitz as Chief Business Officer appeared first on RAAAM Technologies.

The post RAAAM™ Memory Technologies Ltd. Strengthens its Corporate Structure appeared first on RAAAM Technologies.

The post RAAAM™ receives its first in-house 16nm System-on-a-Chip appeared first on RAAAM Technologies.

The post RAAAM™ to Present at Silicon Catalyst’s Summer Portfolio Update appeared first on RAAAM Technologies.

Check out SemiWiki.com interview with RAAAM Memory Technologies CEO, Robert Giterman, to discuss RAAAM’s GCRAM technology, recent achievements, next steps, and more

For the interview

The post Interview on SemiWiki.com appeared first on RAAAM Technologies.

The post RAAAM™ is admitted to Silicon Catalyst appeared first on RAAAM Technologies.

The post RAAAM™’s Technology Demonstrated in 16nm FinFET appeared first on RAAAM Technologies.

The post RAAAM™ is a 2020 >>venture>> winner! appeared first on RAAAM Technologies.