Memory has become a major bottleneck for applications such as AR/VR, Machine Learning (ML), Internet-of-Things (IoT), and Automotive, limiting industry growth. In fact, today, on-chip memory accounts for over 50% of the total chip area. Today’s predominant on-chip memory solution, based on SRAM, no longer provides the density requirements of modern systems, reaching the end of its scaling in advanced CMOS technologies.

RAAAM’s silicon-proven GCRAM technology can be used by semiconductor companies as a drop-in replacement for SRAM in their SoCs, allowing to significantly reduce fabrication costs through a significant die size reduction. Alternatively, increasing the on-chip memory capacity in the same die size enables a dramatic reduction in the off-chip data movement to resolve the memory bottleneck. This increase in on-chip memory capacity will enable additional features that can enable industry growth for applications in the areas of AR/VR, Machine Learning  (ML), Internet-of-Things (IoT), and Automotive.