RAAAM provides the highest-density embedded memory in any standard CMOS technology

Memory has become a major bottleneck for applications such as AR/VR, Machine Learning (ML), Internet-of-Things (IoT), and Automotive, limiting industry growth. In fact, today, on-chip memory accounts for over 50% of the total chip area. Today’s predominant on-chip memory solution, based on SRAM, no longer provides the density requirements of modern systems, reaching the end of its scaling in advanced CMOS technologies.

 

RAAAM’s silicon-proven GCRAM technology can be used by semiconductor companies as a drop-in replacement for SRAM in their SoCs, allowing to significantly reduce fabrication costs through a significant die size reduction. Alternatively, increasing the on-chip memory capacity in the same die size enables a dramatic reduction in the off-chip data movement to resolve the memory bottleneck. This increase in on-chip memory capacity will enable additional features that can enable industry growth for applications in the areas of AR/VR, Machine Learning  (ML), Internet-of-Things (IoT), and Automotive.

IoT & MCU

35%

SRAM IP Area​

Automotive

36%

SRAM IP Area

Mobile

31%

SRAM IP Area

ML/AI & Server

75%

SRAM IP Area

RAAAM provides the highest-density embedded memory in standard CMOS

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developed a unique on-chip memory technology which offers the highest-density embedded memory in a standard CMOS process, requiring no additional process steps or cost.

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technology provides up-to 50% smaller memory footprint compared to the highest-density commercial solutions based on 6T SRAM.

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memory IP which can be used as a drop-in replacement for SRAM,
offering a significant cost reduction, improved bandwidth, and reduced power consumption.

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patented technology has already been proven in silicon with multiple test-chips of leading semiconductor foundries (e.g., TSMC, Samsung, ST Micro).

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